GOB is the abbreviation of Glue on board. It is a packaging technology.
This technology to solve the problem of LED lamp protection. It uses an advanced new transparent material to package the substrate and its LED packaging unit to form effective protection. This material not only has super transparency, but also has super thermal conductivity. The small spacing of GOB can adapt to any harsh environment, and realize the features of real moisture-proof, waterproof, dust-proof, anti-collision, UV resistance, etc.
Compared with traditional SMD, it is characterized by high protection, moisture-proof, water-proof, anti-collision and UV resistance. It can be used in more harsh environments to avoid large areas of dead lights, lights off and other phenomena.
Compared with COB, it is characterized by simpler maintenance, lower maintenance cost, and larger viewing angle. The horizontal and vertical viewing angles can reach 180 degrees, which can solve the problems such as COB’s inability to mix lamps, severe modularization, poor light and color separation, and poor surface flatness.
While it has several advantages, it also comes with some disadvantages:
1. Heat Dissipation Issues
- The resin layer used in GOB can slightly reduce the heat dissipation capability of the LEDs, potentially leading to higher operating temperatures. This can affect the lifespan of the LEDs if not managed properly.
2. Reduced Brightness
- The glue layer may slightly reduce the light output or brightness of the LEDs due to light refraction or absorption by the encapsulation material.
3. Maintenance Challenges
- If an LED or a part of the circuit fails, replacing individual components can be difficult, as the glue layer needs to be carefully removed without damaging the surrounding components.
4. Surface Flatness
- Achieving a perfectly even surface with GOB can be challenging, especially for large panels. Uneven application may affect the overall display quality or introduce visual distortions.
5. Increased Cost
- The GOB process involves additional materials and manufacturing steps, which can increase production costs compared to traditional LED display manufacturing methods.
6. Color Uniformity
- The encapsulating material might slightly alter the color spectrum, which could lead to minor inconsistencies in color reproduction if not calibrated correctly.
7. Potential for Yellowing
- Over time, the glue or resin may yellow due to UV exposure or aging, which can affect the display’s visual quality.
8. Weight Increase
- The added glue layer contributes to a slight increase in weight, which may be a concern for applications where lightweight displays are preferred.
9. Limited Flexibility
- For flexible or curved LED displays, GOB technology can make the modules stiffer, reducing the ability to create highly flexible designs.
By carefully considering these disadvantages, clients can determine whether GOB technology is suitable for the specific applications.
